Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

ABSTRACT

A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 10/408,528,filed Apr. 7, 2003, now U.S. Pat. No. 6,864,153, issued Mar. 8, 2005,which is a continuation of application Ser. No. 09/934,910, filed Aug.22, 2001, now U.S. Pat. No. 6,544,864, issued Apr. 8, 2003, which is adivisional of application Ser. No. 09/574,759, filed May 19, 2000, nowU.S. Pat. No. 6,426,552, issued Jul. 30, 2002.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to methods for using adhesive materials tosecure two or more semiconductor device components to one another.Particularly, the present invention relates to the use ofpressure-sensitive adhesive materials to secure semiconductor devicecomponents to each other. The present invention also relates toassemblies including semiconductor device components that are secured toone another with adhesive materials that include a pressure-sensitivecomponent with sufficient bonding strength to at least temporarilysecure the semiconductor device components to one another and athermoset component for more permanently securing the semiconductordevice components to one another.

2. State of the Art

Adhesives for Securing Components of Semiconductor Device Assemblies andPackages

Adhesives have long been used to secure the various components ofsemiconductor device packages or assemblies to one another.Conventionally, thermoset adhesive materials have been used due to theirbonding strengths when cured.

The most common conventional methods for attaching a semiconductor dieto an interposer, lead frame, printed circuit board, tape, or othercarrier include use of thermoset adhesive materials in the form ofliquids, pastes, preformed structures, or on adhesive tapes or otherelastomeric films. When cured, thermoset adhesive materials have highbond and cohesive strengths, which are desirable for securing thecomponents of a semiconductor device assembly or package to one anotherso as to prevent movement of these components relative to one anotherand the possible damage that may be caused to intermediate conductiveelements, such as wire bonds, or to the components themselves as aresult of such movement.

The types of thermoset adhesive materials that have been used to securethe components of semiconductor device assemblies to one another includeconventional thermoset adhesives, so-called “B-stage” epoxies, andso-called “snap cure” epoxies.

Conventional thermoset adhesives have very low bond strengths prior tobeing cured. Due to these poor bonding strengths, unless thesemiconductor device components that are being secured to one anotherare physically held in place relative to one another, one or both of thesemiconductor device components may shift position relative to theother, resulting in misalignment of the semiconductor device components.In addition, conventional thermoset adhesives that are used to securesemiconductor device components in assembled relationships are typicallycured by exposure to relatively high temperatures for relatively longperiods of time. The temperatures and exposure times that are requiredto cure many conventional thermoset adhesive materials may damagefeatures on the semiconductor device components, such as by inducingthermal stresses therein, by causing thermal mismatching either beforeor after curing, by oxidizing features of the components, or otherwise.Moreover, once conventional thermoset adhesives have been cured, theassembled semiconductive device components cannot be removed from oneanother or repositioned relative to one another.

Snap cure epoxies are similar to conventional thermoset resins in thatthey have low bond strengths prior to curing and, once cured, thesemiconductor device components secured thereby cannot be removed fromeach other or repositioned relative to each other. The cure times ofsnap cure epoxies are, however, very short (minutes or even seconds)relative to the cure times of conventional epoxies. While snap cureepoxies cure more quickly than conventional thermoset epoxies, the curetemperatures remain high (e.g., about 200° C. to about 225° C.) and maycause damage to features on the semiconductor device components.

B-stage epoxies are materials that become tacky after a first, partialcure, imparting these materials with pressure-sensitive adhesivecharacteristics that are sufficient to temporarily hold thesemiconductor device components being secured together in place relativeto one another until the B-stage epoxy has been fully cured. Partiallycured B-stage epoxies also facilitate the removal of one semiconductordevice component from another, as well as repositioning of thesemiconductor device components relative to one another. The first,partial cure of B-stage epoxy is typically effected after applicationthereof to one of the semiconductor device components, but prior toassembling that component with another semiconductor device component.The presence of partially cured, tacky B-stage epoxy on an unassembledsemiconductor device component is somewhat undesirable since materialparticles may adhere thereto, resulting in contamination and possibly inthe failure of an assembly or package including the semiconductor devicecomponent.

Pressure-sensitive adhesives, which typically function at roomtemperature, have poor bonding strengths and low cohesive strengths whencompared with the thermoset adhesive materials that have conventionallybeen used to secure the components of semiconductor device assemblies orpackages to one another. Consequently, pressure-sensitive adhesivematerials are typically not used to permanently secure the components ofsemiconductor device assemblies or packages to one another. Rather,pressure-sensitive adhesives have been used to temporarily secure thecomponents of semiconductor device assemblies until a more permanentmeans of securing can be used, such as encapsulating the assemblies in apackaging material.

The art does not teach a method that includes use of an adhesivematerial to at least temporarily secure the components of asemiconductor device assembly or package to one another at ambienttemperature and subsequently curing the adhesive material at arelatively low cure temperature for a short period of time. Nor does theart teach semiconductor device assemblies or packages includingcomponents secured to one another with such adhesive materials.

Hybrid Adhesive Materials

Recently, a new class of hybrid adhesive material has been developed.These hybrid adhesive materials have a pressure-sensitive component anda thermosetting component. Exemplary hybrid adhesives of this type areavailable from 3M as Structural Bonding Tape 9244, Structural BondingTape 9245, and Structural Bonding Tape 9246, each of which includes anacrylic pressure-sensitive component and an epoxy thermoset component.

At room temperature, due to their pressure-sensitive adhesivecomponents, these hybrid adhesive materials function as conventionalpressure-sensitive adhesives. The bond strengths of these hybridadhesive materials at room temperature are sufficient to temporarilysecure two objects to one another. A more permanent bond between the twoobjects may be formed by subjecting these hybrid adhesive materials toan increased temperature, which cures the thermoset adhesive componentsthereof.

While these hybrid materials have been used in place of rivets, spotwelds, liquid adhesives, and other permanent fasteners that are used instructural applications for large-dimensional components or objectsbeing fabricated, they have not been used to temporarily or permanentlysecure the components of semiconductor device assemblies or packages toone another.

SUMMARY OF THE INVENTION

The present invention includes a method for at least temporarilysecuring the components of a semiconductor device assembly or package toone another at room temperature with a hybrid adhesive material. A morepermanent bond between the components may subsequently be formed byexposing at least the hybrid adhesive material to a relatively lowincreased temperature for a relatively short period of time.

A hybrid adhesive material that includes at least a pressure-sensitivecomponent and a thermoset component may be used to effect the method ofthe present invention. As an example, the pressure-sensitive componentof a hybrid adhesive useful in the method and assemblies of the presentinvention may comprise an acrylic adhesive material, while thethermosetting component may comprise an epoxy thermosetting adhesivematerial. Examples of such hybrid adhesive materials include thoseavailable from 3M as Structural Bonding Tape 9244, Structural BondingTape 9245, and Structural Bonding Tape 9246, each of which includes anacrylic pressure-sensitive component and an epoxy thermoset component.At room temperature, due to their pressure-sensitive components, thesehybrid adhesive materials function as conventional pressure-sensitiveadhesives. At increased temperatures as low as about 120° C. or less,the thermoset components of these hybrid adhesive materials cure, orset, providing a more permanent bond between adhered objects.

In use according to the present invention, the hybrid adhesive materialis disposed between components of a semiconductor device assembly orpackage that have been aligned and that are to be secured to oneanother. The pressure-sensitive component of the hybrid adhesivematerial facilitates the formation of at least a temporary bond betweenthe semiconductor device components at an ambient temperature, such asroom temperature.

Once the semiconductor device components have been assembled and atleast temporarily secured to one another with the hybrid adhesivematerial, the hybrid adhesive material may be subjected to an increasedcure temperature for a predetermined period of time so as to cure thethermoset component of the hybrid adhesive material and to provide amore permanent, more secure bond between the semiconductor devicecomponents. Preferably, the cure temperature is sufficiently low andcure time sufficiently short so as to not substantially damage or inducethermal stresses on any of the assembled semiconductor devicecomponents. For example, the 3M hybrid adhesive materials may be cured,or set, by exposing same to a temperature of about 120° C. for about 95minutes. Of course, higher cure temperatures may alternatively be usedfor shorter durations to cure the 3M hybrid adhesive materials. Whencured, these hybrid adhesive materials provide a bond of sufficientstrength between the assembled semiconductor device components.

The present invention also includes assemblies of semiconductor devicecomponents that include a hybrid adhesive material between at least aportion of two or more of the semiconductor device components, as wellas semiconductor device packages including such assemblies.

Other features and advantages of the present invention will becomeapparent to those of skill in the art through consideration of theensuing description, the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a schematic representation of a die attach apparatus that maybe used to secure components of a semiconductor device assembly orpackage to one another in accordance with teachings of the presentinvention;

FIG. 2 is a cross-sectional representation of a package including asemiconductor die and leads secured thereto by way of a hybrid adhesivematerial in accordance with teachings of the present invention;

FIG. 3 is a cross-sectional representation of an assembly including asemiconductor die secured to a circuit board with a hybrid adhesivematerial in accordance with teachings of the present invention;

FIG. 4 is a cross-sectional representation of an assembly including asemiconductor die secured to an interposer with a hybrid adhesivematerial in accordance with teachings of the present invention;

FIG. 5 is a cross-sectional representation of a stacked, multi-chipmodule including stacked semiconductor dice that are secured to oneanother with a hybrid adhesive material in accordance with teachings ofthe present invention; and

FIG. 6 is a cross-sectional representation of an assembly including asemiconductor die and a heat sink that are secured to one another with ahybrid adhesive material in accordance with teachings of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

A method for securing the components of a semiconductor device assemblyor package to one another employing a die attach system 1 known in theart is illustrated in FIG. 1. A first component 10 of a semiconductordevice assembly 30 is moved along a conveyor 12 of die attach system 1and may be supported by or secured to a support 11 associated withconveyor 12. Although FIG. 1 illustrates die attach system 1 asincluding supports 11 carried on a conveyor belt, conveyor 12 mayalternatively comprise a sprocket-drive apparatus for engaging sprocket,or indexing, holes formed in first component 10 or another known type ofconveyance apparatus. Conveyor 12 moves first component 10 to a positionwhere a dispenser 16 of die attach system 1 may apply a quantity of ahybrid adhesive material 14 from an adhesive source 15 to firstcomponent 10, preferably at about room temperature. Die attach system 1also includes a placement apparatus 17 that positions a second component20 of semiconductor device assembly 30 relative to first component 10and effects the assembly of second component 20 and first component 10,with hybrid adhesive material 14 at least temporarily securing first andsecond components 10 and 20, respectively, to each other.

First component 10 may comprise, for example, a carrier, such as aleadframe, a circuit board, a semiconductor die, a flexible circuit, oran assembly of semiconductor device components. Second component 20 mayalso include a semiconductor die or another component useful insemiconductor device assemblies, such as a heat sink or a lead frame.

Hybrid adhesive material 14 includes a pressure-sensitive component anda thermoset component. The pressure-sensitive component of hybridadhesive material 14 may include an acrylic adhesive material, while thethermoset component may include an epoxy thermoset adhesive material.Exemplary materials that may be employed as hybrid adhesive material 14include the adhesives available from 3M as Structural Bonding Tape 9244,Structural Bonding Tape 9245, and Structural Bonding Tape 9246. At roomtemperature, due to their pressure-sensitive components, these hybridadhesive materials function as conventional pressure-sensitiveadhesives. At increased temperatures, the thermoset components of thesehybrid adhesive materials cure, or set. Preferably, the thermosetcomponent of hybrid adhesive material 14 sets by exposure to atemperature of less than about 200° C. for a duration of less than about100 minutes. The thermoset component may cure when exposed to atemperature of about 120° C. or lower.

Hybrid adhesive material 14 may be applied to first component 10 byknown processes, such as by spraying hybrid adhesive material 14 onto atleast selected regions of first component 10, by spreading hybridadhesive material 14 across a surface of first component 10 (e.g., witha doctor blade), by securing a strip coated with hybrid adhesivematerial 14 to first component 10, by metered-dispensing a quantity ofhybrid adhesive material 14 onto first component 10, by extrusion ofhybrid adhesive material 14 onto first component 10, or by using acontact applicator (e.g., a roller or stamp). Of course, adhesive source15 and dispenser 16 of die attach system 1 include known components thatare configured to apply hybrid adhesive material 14 to first component10 in the desired manner.

Placement apparatus 17 is configured to pick second component 20 from afirst location where a plurality of second components 20 is located,such as a carrier associated with die attach system 1 and to positionand place second component 20 in contact with hybrid adhesive material14 that has been disposed on or applied to first component 10. Whensecond component 20 is placed in contact with first component 10,placement apparatus 17 is preferably also configured to apply sufficientpressure (force) to second component 20 to facilitate adherence thereofto first component 10 by way of at least the pressure-sensitivecomponent of hybrid adhesive material 14. A die attach apparatus usefulin effecting the method of the present invention may include a placementapparatus 17 of a known type, such as a pick-and-place apparatusincluding a vacuum collet or quill configured and fitted to handlesemiconductor dice and other small, fragile objects.

After first component 10 and second component 20 have been aligned byplacement apparatus 17 or at least temporarily secured to one anotherwith hybrid adhesive material 14, assembly 30 may be checked to ensurethat first and second components 10 and 20, respectively, are properlyaligned. Accordingly, die attach system 1 may also include a diagnosticcomponent 18, such as a so-called “machine vision system” (e.g., a“pattern recognition system” (PRS)), of a known type. For example, andwithout limitation, such systems are available from Cognex Corporationof Natick, Mass., as the Cognex BGA Inspection Package™, the SMDPlacement Guidance Package™, the MVS-8000™ product family, and theCheckpoint® product line, the latter employed in combination with CognexPatMax™ software. It is noted that a variety of machine vision systemsare in existence, examples of which and their various structures anduses are described, without limitation, in U.S. Pat. Nos. 4,526,646;4,543,659; 4,736,437; 4,899,921; 5,059,559; 5,113,565; 5,145,099;5,238,174; 5,463,227; 5,288,698; 5,471,310; 5,506,684; 5,516,023;5,516,026; and 5,644,245. The disclosure of each of the immediatelyforegoing patents is hereby incorporated by this reference.

If first component 10 and second component 20 are misaligned, one ofcomponents 10, 20 may be realigned with the other component 20, 10. Iffirst component 10 and second component 20 have been temporarily securedto one another with hybrid adhesive material 14, one of components 10,20 may be removed from the other, then realigned with and readhered tothe other component 20, 10. As an example, placement apparatus 17 may beused to effect such removal, realignment, and readherence.Alternatively, die attach system 1 may include a repositioning element17′ configured similarly to placement apparatus 17 (e.g., apick-and-place apparatus) located down-line from placement apparatus 17.Of course, when repositioning is effected, first component 10 must besecured in place prior to removing second component 20 therefrom.Accordingly, die attach system 1 preferably also includes a brace 13 ofa known type (e.g., a vacuum collet beneath support 11 or a rigid memberextending over at least a portion of first component 10) associated withsupport 11 or conveyor 12 and configured to securely retain firstcomponent 10 to support 11 or conveyor 12.

Once components 10 and 20 have been properly aligned or realigned, thethermoset component of hybrid adhesive material 14 may be cured byexposing same to an increased temperature. Preferably, the curetemperature and the time duration for which components 10 and 20 areexposed to the cure temperature will not substantially damage or inducethermal stresses on any of the assembled semiconductor devicecomponents. When one of the 3M Structural Bonding Tapes (9244, 9245, or9246) is employed as hybrid adhesive material 14, the following TABLEillustrates the durations for which hybrid adhesive material 14 shouldbe exposed to certain, exemplary set temperatures to substantially cureat least the thermoset components thereof:

TABLE Cure temperature Cure Time 250° F. (121° C.) 95 min. 275° F. (135°C.) 42 min. 300° F. (149° C.) 20 min. 325° F. (162° C.) 10 min. 350° F.(176° C.)  6 min.Hybrid adhesive material 14 may be exposed to an increased temperatureusing known apparatus and methods, such as by placing semiconductordevice assembly 30 in an oven 19 heated to the desired temperature, byheating a support 11 upon which first component 10 is carried to thedesired temperature, or by subjecting the semiconductor device assemblyto directed radiation in the form of, for example, heat lamps 19′.

Of course, second components 20 may alternatively be carried alongconveyor 12 to have hybrid adhesive material 14 applied thereto, whilefirst components 10 are positioned upon and assembled with secondcomponents 20 by way of placement apparatus 17.

Assemblies of semiconductor device components that include a hybridadhesive material 14 between at least a portion of two or more of thesemiconductor device components 10 and 20, as well as semiconductordevice packages including such assemblies, are also within the scope ofthe present invention. Exemplary assemblies incorporating teachings ofthe present invention are illustrated in FIGS. 2-6.

The use of hybrid adhesive material 14 is particularly useful forassembling any two or more semiconductor device components prior toelectrically connecting the semiconductor device components to oneanother.

FIG. 2 illustrates a first embodiment of an assembly 30′ according tothe present invention, which includes a semiconductor die 20′ and alead-over-chip (“LOC”) type lead frame 10′ with leads 32′ that areconnectable to corresponding bond pads 21′ on an active surface 22′ ofsemiconductor die 20′; such as by wire bonds 24′ or thermocompressionbonds. Leads 32′ are secured to active surface 22′ with hybrid adhesivematerial 14 that has been applied directly to leads 32′.

A second embodiment of an assembly 30″ incorporating teachings of thepresent invention, depicted in FIG. 3, includes a semiconductor die 120secured to a carrier substrate in the form of a circuit board 10″ with aquantity of hybrid adhesive material 14. Bond pads 121 of semiconductordie 120 may be connected to corresponding contact pads 40, or terminals,of circuit board 10″ by way of wire bonds 124 or otherwise, as known inthe art.

Referring now to FIG. 4, a third embodiment of an assembly 30′″ of thepresent invention is shown. Assembly 30′″ includes a semiconductor die20′ secured to an interposer 10′″, such as may be used to form achip-scale package, by way of strips 28 of polymeric film that arecoated with hybrid adhesive material 14. As depicted, interposer 10′″includes a slot 50 formed therethrough and a surface 51 with firstcontact pads 52 located adjacent slot 50 and second contact pads 56 thatare arranged on surface 51 and that each communicate with acorresponding first contact pad 52 by way of a conductive trace 54 thatis carried by interposer 10′″. Bond pads 21′ of semiconductor die 20′may be electrically connected to corresponding first contact pads 52 ofinterposer 10′″ by way of wire bonds 53 that extend through slot 50, orotherwise, as known in the art.

FIG. 5 illustrates an embodiment of an assembly 130 comprising astacked, multi-chip module that includes stacked semiconductor dice 110,120 that are secured to one another with a quantity of hybrid adhesivematerial 14 disposed between an active surface 112 of semiconductor die110 and a back side 123 of semiconductor die 120. Bond pads 111 ofsemiconductor die 110 may be connected to corresponding bond pads 121 ofsemiconductor die 120 by way of wire bonds 124, or otherwise, as knownin the art.

Once a semiconductor device and a carrier have been assembled andsecured to one another with hybrid adhesive material 14, as illustratedin FIGS. 2-5, known processes may be used to form electrical connectionsbetween the semiconductor device and the carrier.

As shown in FIG. 6, a fifth embodiment of an assembly 130′ according tothe present invention includes a semiconductor die 120 and a heat sink140 positioned on a back side 123 of semiconductor die 120 so as to drawheat therefrom. Heat sink 140 is secured to semiconductor die 120 with aquantity of hybrid adhesive material 14 disposed between heat sink 140and back side 123 of semiconductor die 120.

Although the foregoing description contains many specifics, these shouldnot be construed as limiting the scope of the present invention, butmerely as providing illustrations of some of the presently preferredembodiments. Similarly, other embodiments of the invention may bedevised which do not depart from the spirit or scope of the presentinvention. Features from different embodiments may be employed incombination. The scope of the invention is, therefore, indicated andlimited only by the appended claims and their legal equivalents, ratherthan by the foregoing description. All additions, deletions andmodifications to the invention as disclosed herein which fall within themeaning and scope of the claims are to be embraced thereby.

1. A method for securing at least two semiconductor device components toone another, comprising: applying an adhesive material comprising apressure sensitive component and a curable component to at least aportion of a surface of a first semiconductor device component; placinga surface of a second semiconductor device component in contact with theadhesive material to temporarily secure the second semiconductor devicecomponent to the first semiconductor device component; and curing thecurable component of the adhesive material.
 2. The method of claim 1,wherein placing comprises pressing the surface of the secondsemiconductor device component against the adhesive material.
 3. Themethod of claim 1, wherein, in placing the surface of the secondsemiconductor device component in contact with the adhesive material,the pressure sensitive component of the adhesive material temporarilysecures the second semiconductor device component to the firstsemiconductor device component.
 4. The method of claim 1, whereinapplying comprises applying the adhesive material to a carrier.
 5. Themethod of claim 4, wherein applying comprises applying the adhesivematerial to at least a portion of a surface of at least one of a leadframe, a circuit board, an interposer, and at least one semiconductordie.
 6. The method of claim 1, wherein placing comprises placing atleast one semiconductor die in contact with the adhesive material. 7.The method of claim 1, wherein placing comprises placing a heat sink incontact with the adhesive material.
 8. The method of claim 1, whereinapplying comprises at least one of spraying the adhesive material,spreading the adhesive material, metered-dispensing of the adhesivematerial, extruding the adhesive material, contact applying the adhesivematerial, and positioning a structure coated with the adhesive material.9. The method of claim 8, wherein spraying comprises atomizing theadhesive material.
 10. The method of claim 1, wherein applying comprisesspreading the adhesive material over only a portion of the surface ofthe first semiconductor device component.
 11. The method of claim 1,wherein applying comprises applying a film including the adhesivematerial on at least portions of opposite surfaces thereof to at leastthe surface of the first semiconductor device component.
 12. The methodof claim 1, wherein curing the curable component of the adhesivematerial comprises heating at least the adhesive material.
 13. Themethod of claim 12, wherein heating comprises heating at least theadhesive material to a temperature of less than about 200° C.
 14. Themethod of claim 12, wherein heating comprises heating at least theadhesive material to a temperature of about 120° C.
 15. The method ofclaim 1, further comprising: repositioning the first and secondsemiconductor device components relative to one another before curingthe curable component of the adhesive material.
 16. A method forsecuring at least two semiconductor device components to one another,comprising: applying an adhesive material comprising a pressuresensitive component and a curable component to at least one of the atleast two semiconductor device components; positioning the at least twosemiconductor device components adjacent to one another with adhesivematerial positioned therebetween to at least temporarily secure the atleast two semiconductor device components to one another; and altering astate of the curable component of the adhesive material to permanentlysecure the at least two semiconductor device components to one another.17. The method of claim 16, wherein, during positioning, the pressuresensitive component of the adhesive material temporarily secures the atleast two semiconductor device components to one another.
 18. The methodof claim 16, wherein, during altering, the curable component of theadhesive material permanently secures the at least two semiconductordevice components to one another.
 19. The method of claim 16, whereinpositioning comprises pressing at least one of the at least twosemiconductor device components toward the other of the at least twosemiconductor device components.
 20. The method of claim 16, whereinapplying comprises applying the adhesive material to a semiconductordevice component that comprises a carrier.
 21. The method of claim 20,wherein applying the adhesive material to a semiconductor devicecomponent that comprises a carrier includes applying the adhesivematerial to one of a lead frame, a circuit board, an interposer, and atleast one semiconductor die.
 22. The method of claim 16, whereinpositioning comprises positioning a carrier adjacent to anothersemiconductor device component.
 23. The method of claim 16, whereinpositioning comprises positioning a heat sink adjacent to anothersemiconductor device component.
 24. The method of claim 16, whereinapplying comprises at least one of spraying the adhesive material,spreading the adhesive material, metered-dispensing of the adhesivematerial, extruding the adhesive material, contact applying the adhesivematerial, and positioning a structure coated with the adhesive material.25. The method of claim 24, wherein spraying comprises atomizing theadhesive material.
 26. The method of claim 16, wherein applyingcomprises applying a film including the adhesive material on at leastportions of opposite surfaces thereof to at least a portion of a surfaceof at least one of the at least two semiconductor device components. 27.The method of claim 16, wherein altering comprises heating at least thecurable component of the adhesive material.
 28. The method of claim 27,wherein heating comprises heating at least the curable component to atemperature of less than about 200° C.
 29. The method of claim 27,wherein heating comprises heating at least the thermoset component ofthe adhesive material to a temperature of about 120° C.
 30. The methodof claim 16, further comprising: repositioning the at least twosemiconductor device components relative to one another before alteringthe state of the curable component.